Electronics Protection
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March/April 2012 Issue Now Available

  • The Lowdown on IP Codes – Ingress Protection of Electrical Products
  • A Case for Safety - AC Arc Fault Circuit Interruption for PV Systems with Microinverters or AC Modules
  • Enclosure Design: IVC’s new Lightweight Explosion-Proof Camera Enclosure System
  • Portable Shock and Vibration Protection
  • Coherent Integrates Marway’s Power Distribution Solution into Energy Efficient, Direct-Diode Laser System Design
  • Industry News and New Products

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Feature Article

Evaluating the Opportunity for DC Power in the Data Center
With data center managers struggling to increase efficiency while maintaining or improving availability, every system in the data center is being evaluated in terms of its impact on these two critical requirements. The power system has proven to be one of the more difficult systems to optimize because efficiency and availability are often in conflict; the most efficient approach to critical power is rarely the most reliable. One solution to power system optimization that deserves serious consideration is DC power.

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Electronics Protection 2011 Resource Guide

Every year Electronics Protection Magazine produces its annual Resource Guide. Inside this PDF you'll find contacts to companies providing solutions to the enclosure, thermal protection, contamination, equipment components, environmental protection, materials, noise protection, hardware, shock/vibration protection, shielding, power protection, testing and custom enclosure services market.

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Enclosures

New Polycarbonate Enclosures Released by Allied Moulded
Allied Moulded Products, Inc. has released its Polyline AMP series of injection-molded products made from polycarbonate thermoplastic. The addition allows Allied to offer both fiberglass and polycarbonate solutions to its customers.

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Thermal Protection

Fujipoly Develops New Low Compression Thermal Gap Filler
To help remove performance-killing heat from today’s complex, multi-level printed circuit board designs, Fujipoly has developed Sarcon GR-SL, a low compression and high-performance thermal gap filler material. When placed on top of uneven components, the material conforms to all gaps, peeks and air pockets making a level, large surface area contact point. The high degree of physical contact allows the heat sink to more efficiently remove unwanted heat.

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