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January/February 2010 Issue Highlights
- Efficiency is the New Mother of Invention:
Combating Thermal Issues with Next-Generation Tools
- Selecting Connectors for Harsh Environments
- Going Beyond Traditional Cooling for Telecom Equipment with “Smart” Fan Controls and High Performance Specifications
- 2010 Electronic Protection Resource Guide
- New Products and Services
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 Every year Electronics Protection Magazine produces its annual Resource Guide. Inside this PDF you'll find contacts to companies providing solutions to the enclosure, thermal protection, contamination, equipment components, environmental protection, materials, noise protection, hardware, shock/vibration protection, shielding, power protection, testing and custom enclosure services market.
Click HERE for to view.
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New Extruded Aluminum Keypad Enclosures from Teko
The new Tekal 3SP enclosures, from Teko, have been designed for desktop and wall mounted keypad devices. Typical applications will include test and measurement equipment, communications, peripherals, security systems and medical and wellness technology.
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New Rackmount Inverter Boasts Industry Leading Power Density in 1U  Package
Schaefer’s AEP-A2000R series of pure sign wave inverters are now UL60950-1 Listed. The series provides 2 KVA of power in a 1U rack design and is available in three input configurations of 12 VDC, 24 VDC and 48 VDC. Outputs are regulated to +/-3 percent or better.
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Triton Introduces High Thermal Conductivity Carbon Composites
Triton has introduced Cryo-Carbon, a new carbon-carbon (C-C) composite material with increased thermal conductivity for extreme heat dissipation applications. Cryo-Carbon is comprised of 70 percent graphite flake, which provides two-dimensional conductivity in excess of 550 W/mK. Unlike pitch-based fiber composites that provide conductivity in the axial direction of the filament, conductive flake offers two-dimensional conductivity, providing increased thermal performance throughout the composite X-Y plane.
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