eNewsletter

April 2010

In This Issue:

 

PRODUCT NEWS

  • Data Translation Releases New Ethernet Vibration Instrument Module
  • Hoffman Syspend 281-Max Provides Heavy Weight HMI Support
  • Adalet Offers High Voltage Termination Enclosures for Hazardous Locations
  • New Solid State Transmitters Designed for Vibration and Temperature Monitoring
  • Low Profile Heat Sinks Cool Hot Components in Constricted Packages

INDUSTRY NEWS

  • XTech Acquires Triple E Corp.
  • Orion Fans Grows More Than 15 Percent in First Half of Fiscal Year
  • Laird Technologies Publishes Thermoelectric Handbook
  • FCI Acquires Assets of MergeOptics

EVENT LISTING

  • The Technology World in One Location!

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EMI Shielding Vents and Filters

Tech-Etch offers a full line of Honeycomb Vents, Fan Vents, Quiet Vents and Air Filters that shield electronic equipment from electromagnetic interference.

Honeycomb Vents are manufactured in both custom and standard configurations. EMI shielding performance is achieved from 1/8-cell aluminum honeycomb panels mounted in high-strength, extruded aluminum frames available in 9 styles. Frame to enclosure shielding options include Twinseal, Mesh gaskets, Beryllium copper shielding strips or Metalized Fabric Gaskets.

Shielded Fan Vents are designed to provide EMI shielding and maximum airflow without degrading the fan output. Tech-Etch stocks fan vents in 5 sizes corresponding to industry standard fans with standard 4-hole mounting. Shielding performance is achieved from 1/8 cell aluminum honeycomb panels mounted in high strength extruded aluminum frames with beryllium copper shielding strips for shielding the frame to the enclosure.

Quiet Vents with honeycomb media provide maximum airflow through openings requiring EMI shielding to 90db attenuation levels. Since the honeycomb design yields 97% open vent area, unrestricted airflow results in reduced turbulence plus lower noise levels than vents constructed from perforated metal. Available in 66 standard sizes, Quiet Vents are an excellent, low-cost shielding solution for the demanding cooling requirements of today's electronic equipment. Lightweight, aluminum frames come standard with a Twinseal gasket for shielding between the frame and the mounting surface.

Thin Screen Shields are composed of expanded multi-layer aluminum and combine the functions of EMI shielding with efficient dust filtering and ventilation. Thinner than electronic filter dust shields, they provide better dust extraction, but with greater restriction of air flow. They cost less than electronic dust shields and honeycomb.

Shielded Filter and Dust Shields perform three functions. They attenuate EMI, provide for a passage of cooling air, and filter dust from the airflow. Designed for use in industrial environments at low to medium airflow rates, they can be cleaned either by inversion and agitation in a suitable solvent or by air blasting. The filter is comprised of three layers of corrugated aluminum mesh aligned to provide maximum dust trapping effectiveness and minimum resistance to airflow.

Visit the www.tech-etch.com/shield/specs.html for full specifications.

 
PRODUCT NEWS

Data Translation Releases New Ethernet Vibration Instrument Module
Data Translation has released the DT8837 Ethernet (LXI) data acquisition instrument module for sound and vibration measurement applications. The DT8837 allows the user to sample up to four 24-bit IEPE accelerometer input channels independently at up to 52.7 kHz per channel or 210 kHz total throughput. Additionally, the DT8837 offers a 24-bit stimulus output, and a 31-bit synchronized tachometer channel for data streams that are matched in time for field or laboratory use.

The TCP/IP Ethernet operation mode of the DT8837 allows measurements to be monitored locally or at other remote locations. Up to 16 instrument modules may be stacked for parallel operation of 64 separate IEPE accelerometer or voltage inputs.  Each of these separate synchronized modules can also be triggered externally in a variety of ways.

ISO-Channel technology utilizes galvanic isolation methods to guarantee 1,000 V isolation between any input channel to any other input channel and ±500 V to earth ground. ISO-Channel vastly increases reliability by implementing unique isolation mechanisms for each 24-bit A/D converter per channel for each of the four input channels and on the 24-bit stimulus D/A output channel, all operating in parallel. The benefit to the user is total isolation of all input/outputs from each other and from digital ground.


Hoffman Syspend 281-Max Provides Heavy Weight HMI Support
Hoffman has released its Syspend 281-MAX HMI suspension system for supporting and/or repositioning Human-Machine Interface (HMI) enclosures and devices up to a maximum load capacity of 281 lbs. The newest addition to Hoffman’s Syspend family of HMI products, the 281-MAX is designed around a modular platform consisting of aluminum tubes and die-cast aluminum components. This system configuration provides a solution for use in a wide range of process control applications where an enclosure needs to be positioned out of the way for cleaning, storage or safety considerations.

The Syspend 281-MAX suspension system includes varying lengths of tubes, elbows, adapters and additional components that can be configured to provide a suspension system for specific applications. The 281-MAX offers ergonomic, fatigue-free operation. Tubing also provides structural integrity and acts as a conduit for equipment wiring, further enhancing the refined look. Plus, the six-fold positive connection between tubes and components, along with recessed mounting areas, deliver a secure attachment. Tubes attach with set screws that grab into the recesses in the system components for increased safety; no additional safety drilling is required.


Adalet Offers High Voltage Termination Enclosures for Hazardous Locations
Adalet is offering new enclosure options for high voltage applications in hazardous locations. The HV4X and XHVX series of high voltage termination enclosures are designed for use in explosion proof/flameproof and increased safety applications.  The enclosures offer a variety of connection options and are designed to handle voltages up to 8 kV and currents up to 500 amps.

The HV4X series of increased safety (Exe) high voltage termination enclosures feature a single door style with clamped cover and are available in stainless steel 316L or 304.  The 1 by 1 connection series is designed for shielded or unshielded cables up to 8 kV at 500 A, while the 2 by 2 connection series is designed for two parallel unshielded cables up to 2 kV at 1 kA total. The HV4X series is offered in sizes from 24 by 12 by 6 inches to 60 by 36 by 16 inches for the 1 by 1 connection series, and 20 by 20 by 8 inches to 60 by 36 by 10 inches for the 2 by 2 connection series. 

The XHVX series of enclosures are designed for use in explosion proof/flameproof applications. Using Adalet’s standard cast aluminum explosion proof junction boxes, the XHVX enclosures include the same connection options and the HV4X enclosure and are approved for use in Division 1 and Zone 1 applications, which require explosion proof / flameproof ratings. XHVX enclosures carry an IP66 rating and designed for high voltage applications with maximum electrical ratings of 8 kV and 1,000 amps.


New Solid State Transmitters Designed for Vibration and Temperature Monitoring
Model 972 solid state loop-powered vibration and temperature sensors from Columbia Research Labs are designed to monitor and trend equipment performance. They provide level monitoring alarm and shut down capabilities in a choice of ranges and response characteristics.

Operating from a 20 V to 36 V power supply, 972 sensors continuously measure both vibration level and temperature, key machinery health parameters and transmit the data directly into a PLC, providing accurate level monitoring. These sensors feature two 4 to 20 mA signal outputs. Outputs are expressed in velocity and acceleration. 972 sensors are offered in two case styles, both of which are case isolated with outputs accessible via standard four pin connectors.

The vibration level output of the 972 indicates either velocity or peak acceleration with factory set ranges of 0 to 1, 0 to 2, and 0 to 5 inches/sec and 0 to 10, 0 to 20 and 0 to 50 Gs pk respectively. The frequency response range is from 5 to 2,000 Hz and + 5 percent accuracy is maintained over an operating temperature range from 0°C to 100°C.


Low Profile Heat Sinks Cool Hot Components in Constricted Packages
Advanced Thermal Solutions, Inc. has introduced a line of lower height maxiFLOW heat sinks for cooling ICs and other hot components in narrow packaging and low airflow velocity conditions. The maxiFLOW heat sinks features a spread fin array that maximizes surface area for more effective convection (air) cooling. Standard sink heights are as low as 9.5 mm.

The heat sinks are fabricated from extruded aluminum, which minimizes thermal resistance from the base to the fins and minimizes weight. Tests on maxiFLOW heat sinks using an airflow rate of just 100 lfm show that device junction temperatures (Tj) can be reduced by more than 40 percent below the temperatures achieved using other heat sinks. 

maxiFLOW heat sinks are provided pre-assembled with ATS maxiGRIP mounting hardware. This attachment system includes a plastic frame clip that snaps securely around the component. A stainless steel spring clip runs through the fin field and fastens to the frame. The result is steady, even mounting pressure with no holes in the PCB. These assemblies meet Telcordia GR-63-Core, ETSI 300 019 and MIL-STD-810 shock and vibration testing standards. A thermally conductive, phase-change interface pad maximizes the heat transfer from component to the cooling solution.
INDUSTRY NEWS

XTech Acquires Triple E Corp.
XTech has acquired TripleE Corp., in Lowell, Massa. TripleE provides ruggedized solutions to the defense, avionics and security industries.

"This acquisition reflects XTech’s strategy of expanding and diversifying into markets that are adjacent to our core front panel and enclosure business," said Reinhold Hesse, CEO. ”The growth rates of the defense/security markets are attractive and stable, with long product life cycles.”

TripleE will become part of Extrusion Technology, Inc., the parent company of the XTech brand. Laurie Burger, chief marketing officer, noted, “The acquisition will broaden our market share in the defense sector, while opening up new opportunities for organic growth through synergies in channel, products and global manufacturing footprint. Given XTech’s ITAR compliance, we can more easily and seamlessly integrate TripleE into XTech’s infrastructure. Our current and new customers are foremost on our minds and our transition team is taking all precaution to ensure success.”


Orion Fans Grows More Than 15 Percent in First Half of Fiscal Year
Orion Fans has again reported record sales through the first half of its current fiscal year. Orion's growth can be attributed to tremendous support from its distributors, continued worldwide success with its AC fan line including the OA254 series fans, and the popularity of its series of high performance Sealed Sleeve DC fans.

"Even in a year like 2009 where the market experienced a large economic downturn, our sales were up over 2008, and there aren't too many companies that can make that statement," said Bob Knight, president of Knight Electronics/Orion Fans. "We're seeing even further improved sales growth thus far in 2010, putting us up more than 15 percent over this time period last year.


Laird Technologies Publishes Thermoelectric Handbook
Laird Technologies, Inc. has released its revised “Thermoelectric Handbook”. The handbook focuses on TEMs and provides in-depth insight into understanding the basic structure and function of TEMs, parameters required for device selection, assembly tips for mounting TEMs onto heat exchangers, and available temperature control options.  Available only online, the handbook is accessible for downloading, viewing, and printing from the Thermoelectric Modules (TEMs) section of the Laird Technologies website:
           
“The Thermoelectric Handbook is a valuable tool that every thermal engineer should reference when specifying a thermoelectric solution in their application,” said Andrew Dereka, Laird Technologies Thermoelectrics Product manager.  “This is a comprehensive tutorial that educates readers on the proper design and installation of thermoelectric modules to avoid the common errors engineers make that can result in a reduced product life or performance limitation of end user’s application unnecessarily.”

Designed for engineers with novice to intermediate thermoelectric experience, the handbook examines Laird Technologies’ TEM product portfolio and discusses TEM construction, function, operation limitations, correct mounting procedures and hardware selection, protection options against condensation, heat transfer formulae, and temperature controller selection.


FCI Acquires Assets of MergeOptics
FCI has acquired the assets of MergeOptics, a manufacturer of active optical cables (AOCs) and optical transceivers. This acquisition will allow FCI to leverage MergeOptics' position in AOCs to complement FCI's passive and active copper cables assemblies to address data and communications market applications.

Data centers and high performance computing applications require that the data-rate performance per channel as defined by various standards be maintained over long lengths of cable. Current applications feature both copper high-speed I/O solutions for short-to-moderate lengths. Applications that require longer cable lengths employ the use of fiber optics via either active optical cables or through the use of transceivers. The market requirements for increased speed and port density continue to drive suppliers towards higher speed solutions increasing the utilization of active optical cables and transceivers as the market drives toward 25 Gb/s per channel high-speed I/O solutions.
EVENT LISTING

megaThe Technology World in One Location!
Top design engineers, system engineers and technical managers from multiple markets and industries will be converging in Dallas this fall, October 18-20, to attend six leading technical events that are being co-located for the first time ever. Make plans today to attend!

Battery Power 2010Thermal Management & Technology Symposium
REMOTE Site & Equipment Management 2010Energy Efficiency Expo 2010
Antenna Systems 2010Electrical Manufacturing & Coil Winding Expo

ELECTRONICS PROTECTION MAGAZINE  

Download the March/April Issue of Electronics Protection Magazine

  • Electrical Standards – A Global Demand for 3rd Party Certification
  • Thermoelectric Cooling for Industrial Enclosures
  • Multiple Axis Rugged?
  • A New Year Brings New Possibilities for OtterBox
  • New Products and Services

Download this Issue Here!

JOB LISTING

Upcoming Industry Events - Click Here to view full Calendar

April 2010

18-20, Blade System Insight Summit, Orlando, Fla. Contact www.bladesystemsinsight.com

25-29, Interop Las Vegas, Las Vegas, Nev. Contact www.interop.com

26-29, ESC 2010, San Jose, Calif. Contact www.esc-sv09.techinsightsevents.com

27-30, MARTS 2010, Rosemont, Ill. Contact www.martsconference.com


May 2010

3-5, Intelligent Transportation Society 20th Annual Meeting & Exposition, Houston, Texas. Contact www.itsa.org

11-13, EDS 2010, Las Vegas, Nev. Contact www.edsc.org

18-20, Electric Power Conference, Baltimore, Md. Contact www.electricpowerexpo.com

19, SMTA Tech Forum & Expo, Toronto, Canada. Contact www.smta.org

21-22, BICSI Technical Education Summit, Denver, Co. Contact www.bicsi.org

23-26, UTC Telecom 2010, Indianapolis, Ind. Contact www.utctelecom2010.utc.org


The 2010 EDS Conference would like your assistance in gaining perspective on the component manufacturers and distributors that areexhibiting “best practices” during this economic recovery period. The following link takes you to a first-of-its-kind EDS All-Industry Survey—addressing engineering, purchasing and corporate management professionals in the electronic components industry.

The results of this survey will be presented at the 2010 EDS conference in Las Vegas, on Monday, May 10, 2010, at 5 p.m. The top three manufacturers and distributors in each category will be recognized at the EDS All-Industry Event.

To help thank you for your time, your name will be entered in a drawing to win one of three 500-Gig external hard drives.  

We thank you again for your interest and support.   

EDS All Industry Survey links to:  http://www.surveymonkey.com/s/EDS2010


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