Save Installation Time and Costs by Specifying an Enclosure Complete with Accessories and Thermal Components
Ensuring reliable performance and long life from electronics is accomplished by protecting them from their environment. In the past, this has been accomplished by ordering the appropriately sized gray box, installing the equipment and hoping the enclosure will withstand its surroundings. Today, customers have more options, including a variety of enclosure types, materials and ratings.

Read the Entire Article Here

New Pluggable Surge Protection Device for Photovoltaic Systems
Phoenix Contact’s VALVETRAB MS surge arresters protect photovoltaic systems up to 1,000 V. The VAL-MS 1000DC/2+V-FM protects two-position DC voltage systems up to 1,000 volts. VALVETRAB MS is also available for other voltages commonly used in small-scale photovoltaic systems and power systems (12 V to 600 VDC).

The rail-mountable arresters protect both insulated and solidly grounded systems. The protective circuit is thermally and dynamically monitored. In the event of damage, it disconnects the arrester from the generator. The VAL-MS surge arresters are also available with or without remote indication contact.

ITSEnclosures Introduces icestation Titan Model
ITSEnclosures has introduced a new icestation model dubbed the Titan. The Titan features a viewing window suited to accommodate wide screen LCD’s, up to 24 inches, a large removable work surface and an integrated roll-out keyboard drawer. The Titan is rated NEMA 12 and is intended for indoor use providing protection against dust, falling dirt and non-corrosive liquids.

“The icestation Titan is the culmination of 25 years of industrial experience,” said ITSEnclosures head engineer Edward Calhoun. “The big difference between the Titan enclosure and previous icestation models is that the Titan was designed specifically to support wide screen LCD’s.”

Magnetic Shield Corp. to Market Nanovate EM Coating for Low Frequency Magnetic Shielding
Integran Technologies, Inc. has entered into a worldwide, market development agreement (MDA) with Magnetic Shield Corp. to provide Nanovate EM coating for low frequency magnetic shielding. Nanovate EM coating technology achieves similar performance to specialty discrete magnetic shielding foils currently offered by Magnetic Shield Corp., but uses a process that allows a nanocrystalline metal to be applied directly to metal, polymer and composite substrates.  The process flexibility enables applications where part size, and/or complexity makes the use of formed foils impractical.  In addition, the Nanovate EM coating also eliminates additional processes such as forming, annealing and assembly. 

The agreement is expected to leverage Magnetic Shield Corp.’s knowledge and customer base to find existing and new applications where Nanovate EM coating would be an effective solution. 

Thermal Gap Fillers Combine High Performance and Low Pricing
New TP-S30 thermal interface pads from MH&W International provide 3 W/mK of thermal conductivity between hot components and heat sinks at lower costs than competing gap filler materials. Pads of TP-S30 thermal gap fillers are soft and compliant for easy compression and filling of air gaps between mounting surfaces to optimize heat transfer. Applications for these gap fillers include alternative energy, consumer electronics, telecommunications, power supplies, flat panel displays and portable electronics.

Pricing for standard TP-S30 gap filler material starts at $0.07 (0.5 mm thick) per square inch. Lower pricing is available for TP-S materials with lower thermal conductivities, i.e. 2 and 1 W/mK (TP-S20 and TP-S10). A low silicone content version, TP-S30LS, has less than 50 parts per million silicone content for applications where silicone-based outgassing can lead to contamination problems or oily silicone residues can hamper assembly. 

All TP-S series gap fillers are provided in 210 by 297 mm sheets, or in standard die cut shapes. Custom shapes are also available. Standard materials have a Shore 00 hardness of 45. Standard thicknesses range from 0.5 to 5.0 mm. All materials are UL94 V0 rated and have a use temperature range of -60° to 200°C.

Server Technology Launches the Next Version of Sentry Power Manager
Server Technology, Inc. has introduced the latest version of the Sentry Power Manager (SPM) software, version 4.2. This new version of SPM contains a streamlined operating system for faster operation and provides accurate data logging using industry standard trending methods. Improved security options include login lockouts for security, blocked creation of certain user names that could take advantage of the system, SSH support over Telnet support, SSL support and per user lockouts for invalid password attempts.

Other feature benefits of v.4.2 include improved trap handling, increased size of email fields, new trendable fields for outlets, infeeds and temperature/humidity and power. SNMP polling is more efficient with less network traffic, and the system can now configure for Celsius or Fahrenheit in displays. The SPM also provides support for 3rd party power distribution units (PDUs), including APC, Geist and Raritan.

Stahlin Non-Metallic Enclosures Becomes Only Enclosures Manufacturer to Hold UL 1741 Certification
Stahlin Non-Metallic Enclosures  have been granted UL1741 certification. The UL1741 standard, entitled Distributed Generation Power Systems Accessory Equipment, is a UL standard essential to product safety and reliability issues within the distributed generation market.

Stahlin enclosures were evaluated under the UL1741 standard for inverter, converter, controllers and interconnection systems equipment for "Use With Distributed Energy Resources" within the US. Stahlin enclosures were also evaluated under the CSA-C22.2 No. 107.1 "Standard for General Use Power Supplies," for use in Canada.

UL File number E333478 denotes Stahlin enclosures as a photovoltaic combiner box component and recognizes the required achievements obtained under prior UL 746C, Polymeric Materials "Use in Electrical Equipment Evaluations" for outstanding UL94-5V flammability rating. UL94-5V is a standard that not all current enclosure manufacturers have attained, especially in tandem with NEMA 6 or 6P type ratings established under UL-50, Enclosures for Electrical Equipment.

Brocade Deploys Technology from Rittal in New Data Center
Rittal Corp. has helped provide critical technology for use in the new Brocade San Jose-based data center. The Brocade data center was designed from the ground up to incorporate key elements of flexibility, energy efficiency, sustainable design and technology innovation.

The new 5,000 square-foot data center incorporates technology from Rittal that provides modular and scalable server and network rack equipment to support Brocade’s energy efficiency initiatives both now and into the future. Rittal’s freestanding data center rack systems have played a key role in the Brocade data center, providing unsurpassed server, switch and power management equipment capacity while supporting the optimized airflow design incorporated into Brocade’s hot aisle containment architecture.

Rittal TS8 modular server and network enclosures provide added weight load capacities and zero-U mounting to allow more equipment to be installed in smaller footprints, helping data center managers to get the most out of their available space. Durable and scalable, the TS8 is the culmination of Rittal's knowledge in modular enclosure technology, including participation in the development of what has come to be the standard 19 inch server rack enclosure.

Pelican Products Named To Prestigious Inc. List for Third Year in a Row
Pelican Products has been recognized by Magazine’s Inc. 5,000 list as one of America’s fastest-growing companies for the third year in a row.

“The universal nature of our virtually indestructible cases and lighting systems has allowed us to open new markets, diversify products and not only survive but flourish in challenging economic times. But our ‘secret weapon’ that makes our business truly go is the ingenuity and can-do attitude of our employees, said Pelican Products, president and CEO, Lyndon Faulkner.  “This award is as great a testament to their hard work as it is to the superior products they make day in and day out.”

The 2010 Inc. 5,000 serves as a unique illustration of the profound changes taking place in the US economy. Despite the fact that most of this year’s measuring period of 2006 to 2009 took place during the latest recession, aggregate revenue among the companies on the list actually increased to $321.6 billion, up more than 50 percent from last year. The effects of the recession are seen, however, in the median three-year growth rate, which dropped to 96 percent from last year’s 126 percent. 

Learn to Push the Limits of Your Designs at Advancements in Thermal Management 2010

Designing consumer and commercial electronics is often a balancing act between high power/output designs and the ability to cool these advanced systems. To help you push the capabilities of your designs, the Advancements in Thermal Management 2010 Conference (Oct. 19th, 2010 • Dallas, Texas) has brought together a group of industry leaders to educate you on the latest thermal management technology. In a relaxed, informative setting you’ll learn about the latest technology to mitigate thermal management design issues and have an opportunity to walk our co-located, multi-conference exhibit hall.

If you are looking to learn more about managing thermal related issues in your power electronics design, this is your must attend event of the year.

Click Here To Learn More About The Conference

September/October 2010 Issue Highlights

• Save Installation Time and Costs by Specifying an Enclosure Complete with Accessories and Thermal Components
  
• Five Factors to Consider When Developing Enclosure Solutions For Mobile Applications
• ESD Protection – An Increasing Challenge with an Increasing Choice of Solutions
• How and Why Surge Protection Devices Fail
• New Products and Services
  
  Download this Issue Here!

October 2010

3-8, EOS/ESD Symposium, Reno, Nev. Contact www.esda.org

19-20, Remote Conference & Expo 2010, Dallas, Texas. Contact www.RemoteExpo.com

19-20, Antenna Systems Conference, Dallas, Texas. Contact www.antennasonline.com

19-20, Battery Power 2010, Dallas, Texas. Contact www.BatteryPowerOnline.com

19-20, Thermal Management & Technology Symposium 2010, Dallas, Texas. Contact www.thermalnews.com

20-22, SCTE Cable-Tec Expo 2010, New Orleans, La. Contact www.scte.org

26-27, SMTA International Electronics Exhibition 2010, Orlando, Fla. Contact www.smta.org

The Technology World in One Location • October 19-20 • Dallas, Texas

Click here to download a brochure

For the first time ever, six leading market-focused events will be co-located and sharing a combined exhibit hall in the Dallas area this fall. Each attracts leading technical professionals in their respective field. Together, it means a show floor populated by top design engineers, system engineers, manufacturing and facility managers, control and wireless communication specialists, and management executives from multiple industries and markets throughout North America.

The event is backed up by the programs of five separate in-depth annual conferences and more than 15 intensive workshops and master classes covering many of today’s hottest technologies and fastest-growing markets. Additionally, a series of free educational classes on energy efficiency for engineers and managers will take place on the exhibit floor for Energy Efficiency Expo.

Discover how and where to integrate new technologies into your systems to improve performance and efficiency, as well as new market trends and how they can impact your company. Find new suppliers and solutions for a variety of technology needs in your organization.

Battery Power 2010 • Advancements in Thermal Management
REMOTE Site & Equipment Management 2010 • Energy Efficiency Expo 2010 • Antenna Systems 2010 • Electrical Manufacturing & Coil Winding Expo

Design & Manufacturing Midwest
Donald E. Stephens Convention Center • Rosemont, IL
September 28-30, 2010

Join thousands industry thought leaders, suppliers, and peers, at Design & Manufacturing Midwest where you'll find this year's show brimming with new equipment, innovative technologies, and top suppliers. Instead of spending weeks or months online and thumbing through catalogues, explore first-hand the latest developments, technologies, products, and services affecting your industry and watch live demonstrations. Register online today and find complete event details at www.DM-Midwest.com

EOS/ESD Symposium
October 3-8, 2010 • Reno NV

The ESD Association 32nd annual EOS/ESD Symposium, Oct 3-8 2010, Sparks (Reno), NV. The international technical forum on electrical overstress and electrostatic discharge that features research, technology, and solutions to increase understanding, enhance quality and reliability, reduce and control costs, and improve yields and productivity. It's the one event where you will find technical papers that emphasize the latest research and technology; basic, intermediate, and advanced tutorials; exhibits of ESD control products and services; workshops; authors' corners; Program Manager Certification; Device/Design Certification; and more.

For complete information or to register visit: www.esda.org

Interop New York
Javits Convention Center
October 18-22, 2010

See all the latest IT solutions at Interop New York’s comprehensive conference and expo. IT and business leaders attend Interop to learn about cloud computing, virtualization, networking and other innovations that drive productivity and cut costs. Don’t miss the leading business technology event. Register with priority code CNSCNY19 for 20% off conference passes or a free expo pass.

IMAPS 43rd International Symposium on Microelectronics
Raleigh Convention Center, NC
Oct. 31-Nov. 4th, 2010

The 43rd International Symposium on Microelectronics will be held at the Raleigh Convention Center, Research Triangle, North Carolina, , and is sponsored by the International Microelectronics And Packaging Society. IMAPS 2010 will feature technical tracks on 3D Packaging/Interconnect, Design, Reliability, Advanced Packaging and Material. 25 technical this year including sessions on: 3D IC at RTP, 3D Packaging, 3D Systems Integration, 3D TSV Processes, Materials, Ceramics/LTCC, Flip Chip, WL/CSP, LED, MEMS, Modeling & Design, Pb-Free Solder, Printed/3D Structural Electronics, Thermal, Wire Bonding and more. This year's symposium will also offer you 18 professional development courses, a GBC Marketing Forum on Photovoltaics and 3D, and keynote presentations from Dr. John Edmond, co-founder CREE Research, and Dr. Rao Tummala, Georgia Tech.