Welcome to Electronics Protection Online eNewsletter

space

October 2011

space

 

space

Feature Article

 

space
space

Evaluating the Opportunity for DC Power in the Data Center
With data center managers struggling to increase efficiency while maintaining or improving availability, every system in the data center is being evaluated in terms of its impact on these two critical requirements. The power system has proven to be one of the more difficult systems to optimize because efficiency and availability are often in conflict; the most efficient approach to critical power is rarely the most reliable. One solution to power system optimization that deserves serious consideration is DC power.

 

Click Here to Read More


White Paper

 

Electroless Black Oxide Of Aluminum Alloys

Black anodize finishes have long been favored by general industry for their thick, hard coating properties. Ironically, it is these very same characteristics that often make the anodizing unusable for many military and aerospace applications.

 

Click Here to Read the Entire White Paper

 

Magnetics

space

  Sponsored Announcement
space

Download Interactive EMI Shielding Catalog

Interactive PDF version of the catalog offers Tech-Etch’s standard and custom EMI/RFI shielding product line in an easy-to-use format that lets the viewer jump from page to page with a click of the mouse and even download sales drawings of selected products. The Table of Contents, Part Number Directory, as well as all internal page number references are clickable. The 52-page catalog features to-scale technical drawings, compression values and metal thickness for over 100 BeCu and stainless steel finger stock shielding profiles.

 

Interactive PDF sales drawings of every profile can be downloaded with a mouse click. For ease of use, profiles are organized by mounting option and arranged by ascending gap Free Height size to help the design engineer locate the proper gasket. Once located the corresponding interactive PDF sales drawing is just a click away.

 

Interactive PDF sales drawings for Metalized Gasket profiles, Fan Vents and one- and two-piece board level shields are also clickable for download. Contact rings, “D” connector gaskets, knitted mesh shielding, elastomer gaskets, filters, and honeycomb vents are offered. Information on material compatibility and specifications, plus compression and attenuation management make this interactive shielding catalog a must for the design engineer.

Download Shielding Catalog PDF 7.2Mb
space
  New Products
 

New Polycarbonate Enclosures Released by Allied Moulded
Allied Moulded Products, Inc. has released its Polyline AMP series of injection-molded products made from polycarbonate thermoplastic. The addition allows Allied to offer both fiberglass and polycarbonate solutions to its customers.

 

Polyline comes standard with multi-mounting capability, including an out-of-the-box mounting flange or adjustable mounting feet that adapt to various mounting configurations. A clear polycarbonate cover option is available for instrumental applications where critical electronic equipment must be visible and protected from the elements.

 

While polycarbonate boxes aren’t new to the industry, what is new, is the idea that one supplier, Allied Moulded, has stepped up to become a one-stop resource where fiberglass and polycarbonate products can co-exist depending on the specific application characteristics and chemical compatibilities.


Fujipoly Develops New Low Compression Thermal Gap Filler
To help remove performance-killing heat from today’s complex, multi-level printed circuit board designs, Fujipoly has developed Sarcon GR-SL, a low compression and high-performance thermal gap filler material. When placed on top of uneven components, the material conforms to all gaps, peeks and air pockets making a level, large surface area contact point. The high degree of physical contact allows the heat sink to more efficiently remove unwanted heat.

 

As Fujipoly’s softest gap filler pad, this formulation provides a thermal conductivity of 2.7 W/m°K with a thermal resistance between 0.94 and 1.69°Cin2/W depending on sheet thickness.  The V-0 tested Sarcon GR-SL is available in 2.5 or 5 mm thick sheets up to a maximum 200 by 300 mm dimension and has an operating temperature of -40°C to 150°C. 


New 1U High 19inch Rack-Mountable AC Power Distribution Unit
Power Sources Unlimited, Inc. has released the Unipower Telecom Vigilant PDU series. Unipower Telecom’s Vigilant series are compact 1RU high 19 inches rack-mountable AC PDUs offering a total of  eight switched NEMA 5-15/20R outlets for the 115 VAC models or eight switched IEC60320-C13 outlets for the 230 VAC models.

 

These smart PDUs offer power monitoring through a front panel mounted true RMS digital current meter as well as remotely via an onboard web server, SNMP services and bundled monitoring and control software. All Models are UL60950-1, CSA22.2 No. 60950-1 (LISTED), EN60950-1 CB.


Littelfuse Introduces SP1006 TVS Diode Array for ESD Protection in Ultra-Small Form Factors
Littelfuse, Inc. has added the SP1006 series to its TVS Diode Arrays (SPA family) of ESD and surge protection devices. The SP1006 series TVS Diode Array is offered in the 0201 form factor (µDFN-2) and provides ESD protection for electronic devices where board space is at a premium. The SP1006 series is particularly suitable for miniature portable electronics applications such as smart phones, MP3/PMP players, portable navigation devices, portable medical devices, and similar handheld equipment.

 

The new SP1006 series is RoHS compliant and complies with the following standards: ESD, IEC61000-4-2, ±30 kV (contact), ±30 kV (air), EFT, IEC61000-4-5, 40 A (5/50ns) and Lightning, IEC61000-4-5, 5 A (8/20μs).
Along with ESD protection (±30 kV, contact) and surge capability (5 A, 8/20 μs), the SP1006 TVS diode array offers minimal capacitive loading with added clamping performance due to its low dynamic resistance of only 0.9 Ω. In addition, the low leakage of <0.5 μA (MAX) at 5 V is designed to maximize circuit reliability and minimize battery drain in portable devices.


Crenlo Introduces IBC Kit to its Lineup of Emcor Accessories
Crenlo has added the Emcor 10-series IBC Tie-Down Kit to its lineup of accessories for Emcor enclosures. Built to secure the Emcor 10-series cabinet to the floor, the IBC Kit meets life safety requirements for protecting building occupants from falling objects in the event of an earthquake as outlined in the International Building Code.

 

The kit contains four frame spacers and four seismic brackets that require the appropriate concrete anchoring hardware to meet local codes as determined by a building engineer. Crenlo’s engineers can work directly with customers and/or their engineers to provide site-specific installation recommendations.

 

“One of our major focuses at Crenlo is to help our customers comply with an array of industry regulations, and with the addition of the Emcor 10-series IBC Tie-Down Kit, we have further strengthened our ability to do so,” said Steven Leidig, manager of enclosure engineering at Crenlo. “Seismic requirements vary by building, geographic region and industry, but our team of in-house experts is dedicated to consulting with our customers on a case-by-case basis to ensure compliance with either of the two major seismic standards.”

  Industry News
 

North American Business Conditions Stabilize, Improvement Seen During Next Six Months
NEMA’s Electroindustry Business Confidence Index (EBCI) indicated that conditions facing the North American electro-industry stabilized in September, after signaling deterioration in each of the three previous months. Just as many survey panelists (20 percent) reported conditions improved from August to September as reported conditions worsened. The rest of the panel (60 percent) reported conditions were unchanged. A month ago nearly 21 percent reported an improvement against about 38 percent reporting a decline. Thus, the EBCI for current North American conditions climbed nearly 9 pointst from August to reach 50 points in September.

 

September’s EBCI for future North American conditions rebounded from the decline posted a month earlier and continues to point toward better conditions over the next six months. The index increased 3.2 points to 58.3 in the latest month. Nearly 37 percent of panelists said they expected conditions to improve by March 2012 versus 20 percent anticipating they will worsen. In August, 31 percent of panelists said they expected an improvement, while nearly 21 percent reported anticipating a decline.


The ESD Association and JEDEC Publish New Revision to Standard for ESD Sensitivity Testing
JEDEC Solid State Technology Association and the ESD Association have published the ANSI/ESDA/JEDEC JS-001-2011 for Electrostatic Discharge Sensitivity (ESD) Testing – Human Body Model (HBM) – Component Level.  The product of an ESDA /JEDEC agreement to produce joint standards in the field of device ESD sensitivity testing, the new revision represents a significant update over the prior version of the standard.

 

The ANSI/ESDA/JEDEC JS-001-2011 revision incorporates several important updates. It includes a significant modification in the required pin combinations that will reduce test times, increase productivity, reduce costs and minimize false failures.  These changes include most non-supply to non-supply (I/O-to-I/O) was eliminated, eliminated “cross-domain” testing of non-supply (I/O) pins, pin combinations for two-pin testing was clarified and the use of single polarity supply-to-supple stressing is now allowed.

 

The prior version of the new standard (JS-001-2010) merged two previously existing, similar test methods developed by ESDA and JEDEC, with the goal of establishing a unified procedure for testing, evaluating, and classifying components and microcircuits according to their susceptibility to damage or degradation by exposure to a defined human body model (HBM) electrostatic discharge (ESD).  ESD can impair the reliability and operation of solid state devices, and test methodologies are becoming ever more critical to the industry as technology advances and device complexity increases.  


PEI-Genesis to Assemble CINCH MIL-C-26500/BACC45 & 63 Connectors
PEI-Genesis, Inc. will add the Cinch MIL-C-26500/BACC45 and 63 product line to its existing interconnection portfolio. Cinch is a manufacturer of electrical connectors for the aviation, military and transportation markets.

“We are delighted to expand our Cinch offering with the addition of BACC and MIL-C-26500 connectors,” said Russel Dorwart, president and COO, PEI-Genesis, “We believe PEI will bring unrivalled speed, availability and technical expertise to the MRO market to put grounded planes back in the air.”

 

Cinch’s MIL-C-26500/BACC45and& 63 connectors meet several Boeing BACC specifications and can be used for both commercial and military aerospace applications. They meet unique application challenges including shielding, environmental sealing, fluid resistance and vibration.


Pentair Technical Products, Hoffman Introduces Spanish Web Site
Hoffman has announced its new Spanish Web Site, hoffmanonline.com/espanol, which features translated sales and support literature, offering Latin American markets native language availability of Hoffman’s content resources. Additionally, users can access a Latin American sales representative locator and an interactive thermal product selection tool to calculate cooling product requirements based on thermal load and enclosure size.

 

space

Event Listings

space
space


Unable to Attend Advancements in Thermal Management 2011? Get the Conference Proceedings!

Were you unable to attend the 2011 Advancements in Thermal Management Conference? If so Click Here to purchase the show proceedings. This resource will provide you with all of the show's presentations, exhibitor information and a list of attendees. If you missed out once, don't do it again! Order Today

space
space
space
space

 

space
  Contact Us  
 

Submit editorial content to Nick Depperschmidt at 720-528-3770 ext 111

 

For advertising information contact Laura Mayo at 720-528-3770 ext 130

 

Webcom Communications • 7355 E. Orchard Road, Suite 100; Greenwood Village, CO 80111
Phone: 800-803-9488 • Fax: 720-528-3771 • www.infowebcom.com

 
  © 2011 Webcom Communications Corp.  

 

 

Webcom Home Directories/CD-ROMs Advertising Subscriptions E-Newsletters Webcom Products Mailing Lists Webcom Events Contact Us Webcom's Publications About Webcom Webcom Home

© 2011 Webcom Communications Corp.