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Using Thermal Simulation to Design a Better Outdoor Electronic Product

Nitesh Kumar Sardana, Thermal Management of Electronics Group
Robert Bosch Engineering and Business Solution Pvt. Ltd., Bengaluru, India

Electronic products operate in varied thermal environments. Their operation is challenged when the size of the housing is reduced and when the product is mounted in an open environment exposed to climatic conditions. Solar radiation increases the temperature difference of the productís internal air from the ambient by 150 to 300 percent. MORE

Adiabatic Technology Helps Cooling Keep Pace with Data Center Growth

Adam Meyer, Sales Manager
Technical Systems, Inc.

Every year, the amount of electronic data that companies process and store grows exponentially. Data centers cannot economically increase the physical space available to keep pace with the growth, and are now challenged to provide more computer power in the same amount of space. The higher levels of microprocessing power in the same physical footprint increases heat density, so owners need more efficient cooling systems that will keep up with the market need without breaking the bank. One technology receiving attention is adiabatic cooling, which uses up to 90 percent less water than other systems. MORE

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Cambridge Nanotherm Partners with Inabata for Global Sales and Distribution
Eaton Furthers Commitment to Data Center Innovation with Open Compute Project Foundation Membership
PDI Forms Partnership with Greensource Cincinnati
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ROLEC conFORM EMI/RFI Shielded Enclosures Now in 14 Sizes
Polycase Introduces Line of NEMA Steel Enclosures
Electronics Enclosures for Rugged Applications
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Vertiv Expands Software Portfolio With New Version of Trellis Power Insight
GE Introduces Rugged, Resilient Power Supply for Industrial Applications
OPC UA Enables Fast, Reliable Communication for Power Supplies
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Element Six Introduces Electronically Conductive CVD Diamond Heat Spreader – Diafilm ETC700
AC Unit Delivers Close-Coupled Cooling Directly to a Wall-Mount Rack Cabinet
Zymet UA-2605-B Reworkable Edgebond Adhesive Enhances Board Level Reliability of Large WLCSP
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