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Thermal-Fluid Modeling for Flat Thin Heat Pipes/Vapor Chambers

Mohammed T. Ababneh and Pete Ritt
Advanced Cooling Technologies

Frank M. Gerner,†University of Cincinnati†

Rapid and continuous improvement in electronic systems technology has necessitated greatly improved thermal management products and solutions. With these thermal management product advances also comes the challenge of developing more sophisticated modeling techniques to identify and understand key aspects which affect device performance.† MORE

Seven Essential Cabinet Design Considerations for Protecting 19 Inch Electronics

Vlad†Konopelko†is Product Marketing Manager, North America,
Pentairís Schroff brand

The latest advancements in electro-mechanical technologies, coupled with stringent compliance and compatibility requirements, allow for the development and deployment of high-performance electronics beyond traditional 19 inch Data-Communications and Telecommunications applications. † MORE

Mitsubishi Electric Adds Second Test Facility to Accommodate Rapid Growth
Enclosure Shielding Catalog Released
Orbel Corp. Launches new Product Catalog
Fibox Adds Three New Sizes to the ACRA Line
AMCO Enclosures Aluminum Structural Framing System Offers Unmatched Strength and Scalability
New Size Option Available in Gasketed Electronic Enclosures
Richardson RFPD Introduces the Latest Addition to K2 Series of Ultracapacitor Cells from Maxwell
MTU Onsite Energy Announces Power Generation Rating for Data Center Industry
Minuteman Launches New Endeavor 5-10kVA Series Online Battery Backup Systems
FLIR Releases new OEM Thermal Imaging Core Muon
Drip-Free Quick Disconnects for Liquid Cooling
AIT Introduces Novel High Temperature Large Area Underfill with Stress Absorption