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Thermal-Fluid Modeling for Flat Thin Heat Pipes/Vapor Chambers

Mohammed T. Ababneh and Pete Ritt
Advanced Cooling Technologies

Frank M. Gerner,†University of Cincinnati†

Rapid and continuous improvement in electronic systems technology has necessitated greatly improved thermal management products and solutions. With these thermal management product advances also comes the challenge of developing more sophisticated modeling techniques to identify and understand key aspects which affect device performance.† MORE

Seven Essential Cabinet Design Considerations for Protecting 19 Inch Electronics

Vlad†Konopelko†is Product Marketing Manager, North America,
Pentairís Schroff brand

The latest advancements in electro-mechanical technologies, coupled with stringent compliance and compatibility requirements, allow for the development and deployment of high-performance electronics beyond traditional 19 inch Data-Communications and Telecommunications applications. † MORE

articles
Mitsubishi Electric Adds Second Test Facility to Accommodate Rapid Growth
Enclosure Shielding Catalog Released
Orbel Corp. Launches new Product Catalog
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Fibox Adds Three New Sizes to the ACRA Line
AMCO Enclosures Aluminum Structural Framing System Offers Unmatched Strength and Scalability
New Size Option Available in Gasketed Electronic Enclosures
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20 A DC-UPS with Individual Battery Monitoring
Richardson RFPD Introduces the Latest Addition to K2 Series of Ultracapacitor Cells from Maxwell
MTU Onsite Energy Announces Power Generation Rating for Data Center Industry
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Sarcon SPG-20B Delivers Lower Thermal Resistance and Higher Thermal Conductivity
FLIR Releases new OEM Thermal Imaging Core Muon
Drip-Free Quick Disconnects for Liquid Cooling
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