Articles

Cooling Towers Offer Water and Energy Savings as Part of Efficient Data Center Cooling Systems

Douglas Bougher and Kent Martens, P.E.
SPX Cooling Technologies, Inc.

The number of data centers in the United States continues to grow in response to the enormous amount of digital information stored and streamed. The massive computer power within these data centers generates heat, making efficient cooling a key building system requirement. Evaporative cooling towers are an integral part of many data center cooling systems. Continue reading

Prefabrication – The Winning Formula for Edge Data Centers

Mark O’Sullivan, Regional Sales Director
Flexenclosure

Speed to data. That’s what it’s all about. In a world where data is being increasingly generated and demanded planet-wide rather than just in the Tier 1 cities, the winners in the co-location and cloud services race will be the companies that can deliver data the fastest to end users worldwide. Continue reading

Using Thermal Simulation to Design a Better Outdoor Electronic Product

Nitesh Kumar Sardana, Thermal Management of Electronics Group
Robert Bosch Engineering and Business Solution Pvt. Ltd., Bengaluru, India

Electronic products operate in varied thermal environments. Their operation is challenged when the size of the housing is reduced and when the product is mounted in an open environment exposed to climatic conditions. Solar radiation increases the temperature difference of the product’s internal air from the ambient by 150 to 300 percent. Continue reading

Adiabatic Technology Helps Cooling Keep Pace with Data Center Growth

Adam Meyer, Sales Manager
Technical Systems, Inc.

Every year, the amount of electronic data that companies process and store grows exponentially. Data centers cannot economically increase the physical space available to keep pace with the growth, and are now challenged to provide more computer power in the same amount of space. The higher levels of microprocessing power in the same physical footprint increases heat density, so owners need more efficient cooling systems that will keep up with the market need without breaking the bank. One technology receiving attention is adiabatic cooling, which uses up to 90 percent less water than other systems. Continue reading

What Makes an “Ideal” Data Center?

Srikanth Murugan, Global Director Sales Engineering
Flexenclosure

Data centers come in all shapes and sizes, their designs driven by a multitude of factors.  These can be highly disparate, from the purpose it is used for; to the physical environmental it is located in; the materials it’s constructed of; or even who it is designed – global co-location companies, cloud computing specialists, telecom service operators etc. Continue reading

A Designer’s Guide to Smart Battery Applications

Michele Windsor, Direct Sales and Marketing Manager
Accutronics 

When integrating a rechargeable battery into a professional application, especially into a mission critical medical or military device, the first things that come to mind are reliability and safety.  However, there are many other factors designers need to consider throughout the various stages of custom battery design. Here, Michele Windsor, direct sales and marketing manager at professional battery manufacturer Accutronics, guides design engineers through the process of embedding batteries in medical, military or automation applications. Continue reading

Smart Electronic Adhesives for Microelectronics – Enabled by Low Viscosity Nanocomposite Materials

Dr. Andreas Funck, Head of AT Electronics, Evonik Nutrition & Care GmbH
Torsten Lubenow, AT Electronics, Evonik Nutrition & Care GmbH

Abstract
Epoxy resins commonly used for the encapsulation of electronic materials are often filled with various inorganic materials to reduce the coefficient of thermal expansion (CTE), improve thermal conductivity and feature other  mechanical properties. The increase in viscosity that accompanies the increase in filler loading, limits the amount of filler that can be added to a liquid encapsulation system. As a result, highly filled systems are difficult to use in applications that require better flow characteristics such as, flip chip under-fills, transfer molding masses and encapsulates. Moreover, trends of miniaturization require encapsulation systems with much lower viscosity, but with more efficient thermal management. Continue reading