Previous eNewsletter

July 2017

  • Cooling Towers Offer Water and Energy Savings as Part of Efficient Data Center Cooling Systems
  • ROLEC technoPLUS Enclosures Now Rated IP 69K For Jet Wash Protection
  • Pole Kits Extend Enclosure Mounting Options
  • High Insertion Force Ejector Handle from Pixus Ideal for OpenVPX Boards
  • Toshiba Introduces ESD Protection Diodes
  • The Fibre Composite Market: A Land of Opportunities
  • The Road to Fully Flexible Consumer Electronics and the Role of Flexible Encapsulation
  • Verotec Chosen by Lockheed Martin for its Multi Scout SV project
  • Leti and Fraunhofer Team up to Strengthen Microelectronics Innovation

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June 2017

  • Using Thermal Simulation to Design a Better Outdoor Electronic Product
  • Ultra-Thin Magnetic Sheets with High Permeability
  • Polycase Introduces Line of NEMA Steel Enclosures
  • Lord Corp. Makes Micro-Mounts Technology Available to Electronics Components Industry
  • Vertiv UPS Reduces Footprint and Increases Power Density for Large Data Center Customers
  • Zymet UA-2605-B Reworkable Edgebond Adhesive Enhances Board Level Reliability of Large WLCSP
  • PDI Forms Partnership with Greensource Cincinnati
  • UL-Certification for Ventecís IMS Products Extended to Alternative Copper-Base Options
  • EcoCortec Launches European VpCI Plastics Recycling Project
  • TT Electronics Expands Representation Network in Canada

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May 2017

  • Adiabatic Technology Helps Cooling Keep Pace with Data Center Growth
  • Premier Magnetics Drum Cores for EMI Filtering and Switch Mode Power Supplies
  • CamdenBoss Launches Active DIN Rail Enclosures
  • Take the Pressure off and Reduce Enclosure Condensation
  • GlacialTech Announces Igloo FR210 Series Cold Forging Heatsinks
  • How Supercapacitors will Compete with Batteries: Supercapacitor Materials 2017-2027
  • Graphene: Market Update and Future Prospects
  • Liquid Encapsulation Market Ė Forecasts from 2017 to 2022
  • RLE Technologies Acquires Triad Floors from NxGen

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April 2017

  • What Makes an Ideal Data Center
  • Synchronous Step-Down Silent Switcher 2 Delivers 95 percent Efficiency at 2 MHz & Ultralow EMI/EMC Emissions
  • T&B EX Explosion-Proof Solutions Comprise Complete System for Hazardous Environments
  • GRP Inspection Door for Field Instrumentation Enclosures Optimizes Protection in Harsh Processing Environments
  • SMT Inductors from TT Electronics are Robust for Demanding Automotive Applications
  • Potting Compounds Market to Reach $3,460 Million, Globally by 2022
  • Techsil Launches Form-in-Place-Foam-Gasket (FIPFG) Service
  • Equipment and Materials for Fan-Out: What is the Impact?
  • SPX Cooling Technologies Announces Vodcast Series About Cooling Tower Heat Transfer Fill Performance

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March 2017

  • A Designerís Guide to Smart Battery Applications
  • M-Series Reinforced Seismic Cabinets
  • CST Studio Suite Version 2017 Now Shipping
  • Fibox Enclosures Expands its ARCA Enclosure Product Line with IEC Sized ARCAs
  • ROLECís multiPANEL Designer Command/Display Enclosures
  • Stretchable Electronics: Out of the Lab and Into the Market
  • Positrons as a New Tool for Lithium ion Battery Research
  • PICMG Announces New Vision For 2017 and Beyond

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February 2017

  • Taking Full Advantage of CFD in Electrical and Thermal Energy Technology Innovation
  • ROLEC Extends its aluDISC Round Diecast Enclosures Rang
  • Added sizes for Hammond Eclipse Family Further Support IoT and Industry 4.0
  • PEM Type SL Self-Clinching Steel Locknuts for Thin Metal Assemblies Integrate Unique TRI-DENT Feature to Hold Mating Screws Tight
  • 40A Scalable ĶModule Regulator Protects Load by Tripping Upstream Power Source
  • ZPower Announces Battery Bowl Design Challenge with $25K Prize
  • Future Facilities Releases 3rd Video in Binghamton University ES2 Research Project Series
  • Curtiss-Wright Acquires Para Tech Coating
  • Lab Grown (Synthetic) Diamond Market Demand Worth USD 27.6 Billion by 2023 from USD 16.2 Billion in 2016

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January 2017

  • Synthetic Diamond for Thermal Management of Electronic Devices
  • Versatile Heavy Duty EMC RackCase PRO
  • Cortecís EcoSonic ESD Paper offers Corrosion Inhibition, Electrostatic Discharge Protection
  • Pixus Adds New Versatile Features in 1U MicroTCA Chassis
  • Micro Rotary Latch Provides Strength and Security
  • Bourns Miniature Resettable Thermal Cutoff Device Offers Highest Current Capacity
  • RF Code Releases CenterScape 1.2
  • Element Six Extends its Lead in Patents for Single Crystal Synthetic Diamond

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