New Gap Filler Transfers Heat and Absorbs Electromagnetic Waves

Fujipoly
Carteret, NJ —Thursday, September 28, 2017— Fujipoly® introduces a new thermal interface material that also absorbs a wide range of unwanted electromagnetic energy. The tacky, gel-like consistency of Sarcon® EGR-11F makes it easy to handle and apply without requiring additional adhesive. When placed on top of a heat source such as an IC chip, the compliant material fills any unwanted air gaps allowing for more efficient transfer of heat to nearby components or heat sinks.

Sarcon® EGR-11F also provides excellent shielding effectiveness across a broad frequency spectrum while exhibiting a thermal conductivity of 1.0 W/m°K (ASTM D 2326) and a thermal resistance of 1.05°Cin2/W at 14.5 PSI. This highly versatile material is available in three sheet thicknesses (0.5, 1.0, 1.5mm) up to a maximum dimension of 300mm x 200mm. Sarcon® EGR-11F can also be ordered in die-cut form to fit almost any application shape. Fujipoly’s new material is well-suited for environments with operating temperatures that range from -30 to +120°C and exhibits a UL94 flame retardant rating of V-0.

About Fujipoly® America Corporation
Fujipoly® America Corporation is a wholly owned subsidiary of Fuji Polymer Industries Co., Ltd. of Japan. An ISO9001:2008 registered company, Fujipoly® America Corporation specializes in the fabrication of silicone rubber technology. It is a leader in the areas of Zebra® elastomeric connectors, Sarcon® thermal interface materials, fusible tapes, and custom silicone rubber extrusions. Fuji Polymer Industries Co., Ltd., has eight divisions worldwide, located in North America, Europe and Asia and an international network of distributors and representatives. The company’s North American operations are based in Carteret, New Jersey. For more information, call (732) 969-0100 or visit us on the Web at http://www.fujipoly.com.

Comments are closed.