Electronics Protection
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ISSUE
CONTENTS
July 2010
  • Standard, Modified, Configured or Custom Enclosures – It’s Your Choice
  • Desk Stations for Ergonomic Handheld Enclosures
  • Hoffman’s Fusion G7 Enclosure Allows Scalable Component Mounting, Easy Modifications
  • Compact, 2–Stage EMC Filters for 3-Phase Systems up to 520 VAC
  • Meggitt Sensing Systems Introduces the Endevco Model 7268C Miniature Triaxial Shock Accelerometer
  • PEM Self-Clinching Prevailing Locknuts Prevent Mating Hardware from Loosening
  • Stahlin Non-Metallic Enclosures Contributes To The Belding, Michigan High School Robotics Team
  • Thermacore Unveils New Web Site Featuring Thermal Management Technology Applications
  • Ferraz Shawmut Changes its Name to Mersen
  • Webcom Communications Provides new Videos from Industry Leading Electronics Protection Companies

June 2010
  • Passive Thermal Technology: Small Solutions for Big Challenges
  • Stahlin Non-Metallic Enclosures Releases New NW-Series Bonded Window Enclosure
  • Electrorack Introduces HydroCool-IT Passive Rear-door Heat Exchanger
  • New LCR COTS Filters Perform in Extended Temperature Range for Increased Reliability
  • New Thermal Circuit Breaker with Rotary Knob Actuator
  • Meggitt Sensing Systems Debuts Endevco High-G Shock Accelerometers with Integral Electronics
  • APC Selects Kepware Technologies to Deliver Data Center Device Communications
  • Laird Technologies Launches Online EMI, Thermal Management and Wireless M2M Solutions Stock Locator
  • XTech Completes ITAR Compliance Program
  • Coolcentric Opens New Briefing and Demonstration Center
  • Attend a FREE HART Workshop at the Remote 2010 Conference & Expo

May 2010
  • Thermoelectric Cooling for Industrial Enclosures
  • Cabinet Helps Alleviate Temperature Concerns When Installing Control Panels
  • New Shielding Technology for Space Constrained Applications
  • New Circular Wire Rope Isolators from AAC Feature a Low Profile for Compact Military and Industrial Applications
  • New CE Compliant Cabinet Coolers For Electrical Enclosures
  • New Circuit Breakers Keep Systems Running
  • CoolIT Systems Provides Dual CPU Liquid Cooling for MAINGEAR Quantum Shift PC
  • Eaton Helps Resellers Service Public Sector with TAA Compliant UPS Products
  • Thermacore Leads Largest Collaborative Nanotechnology Project

April 2010
  • Data Translation Releases New Ethernet Vibration Instrument Module
  • Hoffman Syspend 281-Max Provides Heavy Weight HMI Support
  • Adalet Offers High Voltage Termination Enclosures for Hazardous Locations
  • New Solid State Transmitters Designed for Vibration and Temperature Monitoring
  • Low Profile Heat Sinks Cool Hot Components in Constricted Packages
  • XTech Acquires Triple E Corp.
  • Orion Fans Grows More Than 15 Percent in First Half of Fiscal Year
  • Laird Technologies Publishes Thermoelectric Handbook
  • FCI Acquires Assets of MergeOptics

March 2010
  • Electrical Standards – A Global Demand for 3rd Party Certification
  • Laird Technologies Releases the Next Generation of Tunnel Series Thermoelectric Assemblies
  • ASI Releases New Circuit Breaker Line
  • OtterBox Releases Cases for Nokia 5800
  • New EMC Metal Liquid Tight Cord Grips Designed for EMC Applications
  • Elma Releases New AMC Handles
  • Are the Days of an American Market for Axial Fans Numbered?
  • Buckeye Shapeform Receives Top Industry Quality Accreditations
  • Emerson Completes Acquisition of Avocent
  • Advanced Thermal Solutions Offers Fixed-Price Heat Sinks with QoolPCB Program

February 2010
  • Selecting Connectors for Harsh Environments
  • Stahlin Introduces New Extensions for J Series Enclosures
  • New Dual Protection Gaskets from Leader Tech
  • New 100 W AC/DC Power Supplies in a 2 inch By 4 inch Footprint
  • Low-Cost, Low-Resistance Connector
  • New UPS Increases Reliability of Industrial PCs
  • Syracuse Opens Green Data Center with Cabinets Powered by Server Technology’s PDUs
  • Argus and Alpha Merge
  • IQS Testing Purchased by the Compliance Management Group
  • Caliente Earns ISO Certification in Quality Management Systems

January 2010
  • Combating Thermal Issues with Next-generation Tools
  • New Harsh Environment Shielding  Gasket from Leader Tech
  • Pelican Hardigg Introduces 33 Inch DE Cases
  • Digital Staging Controller Drives Contactors for up to 10 Heaters or Cooling Devices
  • LineGuard Surge Suppressors Protect Vulnerable Data Lines
  • Style 96 Lift-Off Hinges from Southco Provide Greater Design Flexibility
  • Raritan Enters Into Alliance with Capgemini to Help Clients Improve Data Center Efficiencies
  • Ferraz Shawmut Introduces New Electrical Services
  • All American to Distribute Solutions from Power-One

December 2009
  • Stainless Steel Enclosures in Industrial Applications
  • New Extruded Aluminum Keypad Enclosures from Teko
  • Laird Technologies Introduces New EMI Gemini Product Line
  • Triton Introduces High Thermal Conductivity Carbon Composites
  • New Rackmount Inverter Boasts Industry Leading Power Density in 1U Package
  • Glacier Computer to Offer Toughbook Mobile Computers
  • NEMA Publishes VE 1-2009 Metal Cable Tray Systems
  • Hoffman Enclosures now Available in Growing India Market
  • Active Power Receives Second Multimillion Dollar Order from Internet Search Engine Provider

November 2009
  • Reviewing Cabinet Enclosures for Your Design Application
  • Pelican Introduces the 1740 and 1770 Long Cases
  • Hoffman Utility Junction Enclosures Gain RUS Acceptance
  • Schruter Releases New Three-Phase EMC Filters
  • Orion Fans Develops Long Life, Low Cost Sealed Sleeve Bearing DC Fans
  • Russelelectric 30-Cycle-Rated Transfer Switches Simplify Selective Coordination
  • Endevco Launches New “-R” Discounted Replacement Sensors Program
  • Digi-Key Corp. and Cooper Bussmann Expand Distribution Agreement
  • Para Systems Forges Alliance to Market General Electric’s Three-Phase UPS Products
  • AdaptivCool Signs Agreement with Yamatake Corp. to Sell AdaptivCool Data Center Cooling Solutions in Japan

October 2009
  • Global Enclosure Standards within the Electrical Industry
  • Quiet Chassis Cuts Noise by 24 to 28 dB
  • New Family of General Purpose and IP66 Small Die-Cast Aluminum Enclosures
  • New Gasket Design for EMI Shielded Honeycomb Vents Improves Performance at a Reduced Cost
  • Future Facilities Releases New Electronic Cooling Software
  • H Series Power Distribution Terminal Blocks from ASI
  • How Much do You Know About ARC Flash Hazards
  • NEMA Publishes ANSI C119.5-2009 Electric Insulation Piercing Connectors Standard
  • Thermacore, Inc. Acquires k Technology
  • Vynckier Enclosure Systems Moves VJ Line Manufacturing to US

September 2009
  • Understanding and Managing Critical Power Systems with Energy Management Software
  • Canyonwest Expands Its Selection of Injection Molded Cases
  • Rittal Co-location Rack Enclosures Optimized for Multi-User and Offsite Managed Hosting Applications
  • Bourns Releases SRF Series of Line Filters for EMI Suppression
  • AVX Tantalum Division Receives DSCC Approval for TBW Fused Tantalum Chip Series
  • Crydom Introduces HS Series of Heat Sinks and Solid State Relay Assemblies
  • Arlington Capital Partners Announces the Acquisition of J.A. Reinhardt and Company, Inc.
  • Thermal Management Technologies (Heat Sinks) Global Strategic Business Report Is Available
  • Universal Air Filter Products Meet European Union REACH Standards
  • Mouser Electronics Expands Product Offering from CTS Corp.

August 2009
  • Passive Cooling Choices Expand
  • 240 V NEMA Enclosures with Euro Style Plugs Added to L-com’s Product Portfolio
  • Optima Debuts Dust-Proof Instrumentation Cases
  • Leader Tech Introduces Shielding Solution for Tight Space
  • New Non-Incendive Barrier Modules Prevent Explosions
  • Pfannenberg, Inc. Releases Two New DTS 3000 Series Models
  • Trip or a Blip for Circuit Breaker Market in 2009
  • Chatsworth Products Acquires Epicenter, Inc. 
  • Aavid Thermalloy to Globally Distribute Thermal Solutions Heat Sink and Attachment Products
  • NEMA Publishes SG 4-2009 Alternating Current High-Voltage Circuit Breakers
  • Remote 2009 Conference & Expo Discount Registration Deadline – Sept. 3rd, 2009

July 2009
  • Meeting the Requirements of Today’s Telecommunication Networks
  • Tripp Lite Introduces SmartRack Enclosures For Easy Equipment Installations
  • New Ergonomic Soft-Touch Hand-Held Enclosures from Teko
  • Slim Line EMI Filter Series Combines Power Entry Functions to Reduce Assembly Time and Material Costs
  • AdaptivCool Enhances Data Center Hot Spot Elimination Tool
  • Elma Introduces Heat Sink Front Panels
  • The SES40 Offers Effective Protection for Electronics from Lightning Transients and Surges
  • AD Products Introduces Product Lines for Hazardous Locations
  • Ferraz Shawmut Launches Fuse Control Program to Help Facilities get Control of Plant Assets
  • Survey of Emerson Network Power’s Data Center Users Group Shows Energy
  • Efficiency and Monitoring on the Rise
  • Hybricon Corporation Joins OpenVPX Industry Working Standards Group

June 2009
  • Selecting the Proper Circuit Breaker for Your Application
  • Optima Releases Command and Communication Consoles
  • OtterBox Impact Series Case Keeps BlackBerry Curve Thin and Stylish
  • New 2.45 GHz Cable Ferrites from Leader Tech
  • Control Minimizes Energy Used for Cooling Panels
  • New Arc-Flash Detection Relay from SEL Minimizes Dangerous Arc-Fault Energy
  • New Calmark Torque-Limiting Card-Lok Retainers Prevent Board Damage
  • S.I.E. AG Acquires Carlo Gavazzi Computing Solutions, Inc. Assets
  • NEMA Publishes New Standards for Outlet Boxes, Device Boxes, Covers and Box Supports
  • CoolIT Systems Acquires Delphi Liquid Cooling Assets
  • Nextreme and Nucletron Technologies GmbH Agree To Sell Thin-Film Thermoelectric Products In Europe
  • Chatsworth Acquires Epicenter, Inc.

May 2009
  • UPS Preventive Maintenance Can Save You Money and Headaches
  • Verotech Adds Desktop Enclosure for Standard Eurocards to Product Line
  • ITSEnclosures Introduces ViewStation QSR
  • Metalized EMI Filters from LCR Electronics Increase Appliance Safety
  • Rittal Producing UL Type 4X Stainless Steel Air Conditioners in US
  • HP Ships Three-Phase 14.4 kVA PDU with Power Monitoring
  • Pentair Electronic Packaging Completes Directorate of Defense Trade Controls Compliance Program for ITAR Products
  • XTech Re-Capitalized by RFE Investment Partners
  • GE To Reduce Annual Energy Consumption and Water Usage in Company Data Center
  • CPI Opens RD&T Center with State-Of-The-Art Thermal and Product Test Labs

April 2009
  • Verotech Adds Desktop Enclosure for Standard Eurocards to Product Line
  • Canyonwest Cases Debuts New SKB Shock-Rack Cases
  • New L-shaped EMI/ IP Gasket from Holland Shielding
  • New Non-Silicone Thermal Gap Filler from Fujipoly
  • Leviton Debuts New Standard and Surge Protected PDUs
  • Hybricon Corp. Achieves AS9100 Certification
  • Celsia NanoSpreaders Cool Next Generation Solar Power Arrays
  • Heilind Electronics Named Distributor of Jaro Thermal Cooling Products
  • First Volume of Qpedia Thermal eMagazine Articles Now Available In Hardcover Book

March 2009
  • It’s 2 a.m. Is your UPS safe?
    Making the Case for Monitoring and Diagnostic Services
  • 3U Shallow-Depth Chassis Designed for Mobile Apps
  • AFCO Systems Releases New Generation of Passive, High-Density Datacenter Enclosures 
  • Laird Technologies Introduces New EMI Sentry Product Family
  • Flared Pin Heat Sinks Provide Alternative for Natural Convection 
  • XTech Launches Fastener-Reinforced MicroTCA faceplates
  • Ferraz Shawmut’s Surge-Trap Surge Protection Devices Meets UL 1449 3rd Edition Standard
  • Mouser Electronics and Wurth Electronics Midcom Sign Distribution Agreement
  • Elma Electronic Acquires ACT/Technico
  • IBM Technology Licensed by Vette Receives Patent Approval
  • IDES Goes Green with Natural Cooling, Wind Power

February 2009
  • Physical Threat Management Techniques for Data Center Security
  • Next Generation F-Series TeraFrame Offers Enhanced Features
  • T1FLO Enclosure Protects Heat-Sensitive Controls with Integrated Fan and Filter Design
  • Kooltronic Debuts New Compact Air Conditioning Solution
  • New Generation of Circuit Breaker Power EntryModules Mount in Tight Spaces
  • UAF Introduces Thinnest Filter Media to Meet NEBS Standards
  • Leader Tech Completes Phase II Expansion of Global EMI Shielding Technology Center
  • Thermacore to Develop Active Heat Sink Technology
  • RAMPF Group Acquires the Form-in-Place Gasketing Division of Chemque, Inc.
  • ITSEnclosures Partners With Distributor For Digital Signage LCD Enclosures

January 2009
  • The Thermal Barrier: A Thin-Film Thermal Solution For Hot Electronics
  • Elma Releases 3U MicroSlim Enclosure For MicroTCA
  • EIC Introduces DVR Enclosure
  • New Thermal Interface Putty from Fujipoly
  • Laird Technologies Introduces LI0201 Ferrite Chip Beads
  • UPS Features Multi-Module Paralleling Capabilities for Large Data Centers
  • Global Market for Conformal Coatings in Electronics Worth $9.1 Billion in 2013
  • SolaHD Wins Frost & Sullivan 2008 Global Competitive Strategy Leadership Award
  • Mouser Electronics and Wurth Electronics Midcom Sign Distribution Agreement
  • Pelican Products, Inc. Acquires Hardigg Industries  
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